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4寸藍寶石襯底

2014-09-01




藍寶石晶片



Item


4"

Unit

 Dimension


Diameter:


100 ± 0.15

mm


Thickness:


650 ± 20

um


Primary Flat:


301.0

mm

Orientation


Surface-cut:


C plane : Tilt 0.2°±0.1° in M axis /

~


Primary Flat:


A plane : 0° ± 0.15°

~

Flatness


Bow:


 0 ~ (-10)

um


Warp:


20

um


Total Thickness Variation (TTV):


10

um


LTV


2.5

um


Front side Roughness


0.2

nm


Back side Roughness


0.8-1.2

um


Cleanliness


No particles and fingerprints

~


4.Material Quality


High-purity mono-crystal Al2O3

~

 

5.Package


Wafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.


~

 

6.Trace Ability


Wafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.


~

 

7.Laser Mark


Front or Back side


~

 

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