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    4寸藍寶石襯底

    2014-09-01




    藍寶石晶片



    Item


    4"

    Unit

     Dimension


    Diameter:


    100 ± 0.15

    mm


    Thickness:


    650 ± 20

    um


    Primary Flat:


    301.0

    mm

    Orientation


    Surface-cut:


    C plane : Tilt 0.2°±0.1° in M axis /

    ~


    Primary Flat:


    A plane : 0° ± 0.15°

    ~

    Flatness


    Bow:


     0 ~ (-10)

    um


    Warp:


    20

    um


    Total Thickness Variation (TTV):


    10

    um


    LTV


    2.5

    um


    Front side Roughness


    0.2

    nm


    Back side Roughness


    0.8-1.2

    um


    Cleanliness


    No particles and fingerprints

    ~


    4.Material Quality


    High-purity mono-crystal Al2O3

    ~

     

    5.Package


    Wafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.


    ~

     

    6.Trace Ability


    Wafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.


    ~

     

    7.Laser Mark


    Front or Back side


    ~

     

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