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                              4寸藍寶石襯底

                              2014-09-01




                              藍寶石晶片



                              Item


                              4"

                              Unit

                               Dimension


                              Diameter:


                              100 ± 0.15

                              mm


                              Thickness:


                              650 ± 20

                              um


                              Primary Flat:


                              301.0

                              mm

                              Orientation


                              Surface-cut:


                              C plane : Tilt 0.2°±0.1° in M axis /

                              ~


                              Primary Flat:


                              A plane : 0° ± 0.15°

                              ~

                              Flatness


                              Bow:


                               0 ~ (-10)

                              um


                              Warp:


                              20

                              um


                              Total Thickness Variation (TTV):


                              10

                              um


                              LTV


                              2.5

                              um


                              Front side Roughness


                              0.2

                              nm


                              Back side Roughness


                              0.8-1.2

                              um


                              Cleanliness


                              No particles and fingerprints

                              ~


                              4.Material Quality


                              High-purity mono-crystal Al2O3

                              ~

                               

                              5.Package


                              Wafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.


                              ~

                               

                              6.Trace Ability


                              Wafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.


                              ~

                               

                              7.Laser Mark


                              Front or Back side


                              ~

                               

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